BYH
BYH B-B050
  • Detail

Serial number of the products:BYH B-B050

Products Description:
 full conductive sponge is a paragraph for EMI Shield, ESD grounding of products, and the products X-Y-Z axis direction are has good of conductive performance, contact resistance low and the high shield, very good of elastic and the elastic recovery performance, through products life aging test determine has very excellent of reliability, very good of stick with performance, and in rushed cut process in the not occurred off chip sex condition, various base material are can fitting < conductive no spinning cloth, conductive copper foil, guide full conductive sponge is a paragraph for EMI Shield, ESD grounding of products, and the products X-Y-Z axis direction are has good of conductive performance, contact resistance low and the high shield, very good of elastic and the elastic recovery performance, through products life aging test determine has very excellent of reliability, very good of stick with and in rushed cut process in the not occurred off chip sex condition, various base material are can fitting < conductive no spinning cloth, conductive copper foil, conductive foil, conductive wheat cloth

Product features: full range of conductive foam material is soft, lightweight, good elasticity, suitable for manufacturing various I/O interface, pad LCD cushions and other purposes. EMI (electromagnetic interference) shielding, ESD (static) grounding, a variety of thickness available: 0.13mm-20mm

Instructions for use: full range designed specifically for EMI shielding conductive sponge, let EMC devices using safer, conductive to d; can be used in electrostatic ESD production and diversification of consumption component, sponges unique flexibility makes it a unique long term reliability, resistance and high compression resistance large intervals. Construction thickness of 30%-70%, least compressed thickness: 0.1mm

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